Granted Patent
Utility
US 6,395,607 · App. 09/328,647
Integrated circuit fabrication method for self-aligned copper diffusion barrier
Inventor:
Henry Chung
Patented Case
View Patent ↗
Granted: May 28, 2002
Filed: Jun 9, 1999
Inventor
Henry Chung
Assignee (at issue)
AlliedSignal, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.