IP Library Granted Patent US 6,399,418
Granted Patent Utility
US 6,399,418 · App. 09/916,719

Method for forming a reduced thickness packaged electronic device

Inventors: Thomas P. Glenn, Steven Webster, Roy Dale Hollaway
Patented Case View Patent ↗
Granted: Jun 4, 2002 Filed: Jul 26, 2001
Inventors
Thomas P. Glenn
Steven Webster
Roy Dale Hollaway
Assignee (at issue)
Amkor Technology, Inc.

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Quick Facts
Patent No.
US 6,399,418
App. No.
09/916,719
Filed
2001-07-26
Granted
2002-06-04
Kind
B1