Granted Patent
Utility
US 6,399,476 · App. 09/432,101
Multilayer passivation process for forming air gaps within a dielectric between interconnections
Inventors:
Jin Yang Kim, Si-Woo Lee, Won-seong Lee, Sang-Pil Sim
Patented Case
View Patent ↗
Granted: Jun 4, 2002
Filed: Nov 2, 1999
Inventors
Jin Yang Kim
Si-Woo Lee
Won-seong Lee
Sang-Pil Sim
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.