IP Library › Granted Patent US 6,399,505
Granted Patent Utility
US 6,399,505 · App. 08/954,175

Method and system for copper interconnect formation

Inventor: Takeshi Nogami
Patented Case View Patent ↗
Granted: Jun 4, 2002 Filed: Oct 20, 1997
Inventor
Takeshi Nogami
Assignee (at issue)
Advanced Micro Devices, Inc.

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Quick Facts
Patent No.
US 6,399,505
App. No.
08/954,175
Filed
1997-10-20
Granted
2002-06-04
Kind
B2