Granted Patent
Utility
US 6,402,012 · App. 09/435,843
Method for forming solder bumps using a solder jetting device
Inventor:
Timothy D. Bolduc
Patented Case
View Patent ↗
Granted: Jun 11, 2002
Filed: Nov 8, 1999
Inventor
Timothy D. Bolduc
Assignee (at issue)
Delphi Technologies
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.