IP Library Granted Patent US 6,402,014
Granted Patent Utility
US 6,402,014 · App. 09/689,804

Method of forming bumps

Inventors: Kosuke Inoue, Asao Nishimura, Takamichi Suzuki, Teru Fujii, Masayuki Morishima, Yasuyuki Nakajima, Noriyuki Oroku
Patented Case View Patent ↗
Granted: Jun 11, 2002 Filed: Oct 13, 2000
Inventors
Kosuke Inoue
Asao Nishimura
Takamichi Suzuki
Teru Fujii
Masayuki Morishima
Yasuyuki Nakajima
Noriyuki Oroku
Assignee (at issue)
HITACHI, LTD.

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Quick Facts
Patent No.
US 6,402,014
App. No.
09/689,804
Filed
2000-10-13
Granted
2002-06-11
Kind
B1