Granted Patent
Utility
US 6,404,043 · App. 09/598,343
Panel stacking of BGA devices to form three-dimensional modules
Inventor:
Harlan R. Isaak
Patented Case
View Patent ↗
Granted: Jun 11, 2002
Filed: Jun 21, 2000
Inventor
Harlan R. Isaak
Assignee (at issue)
Dense-Pac Microsystems, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.