Granted Patent
Utility
US 6,404,046 · App. 09/497,377
Module of stacked integrated circuit packages including an interposer
Inventors:
Thomas P. Glenn, Steven M. Anderson
Patented Case
View Patent ↗
Granted: Jun 11, 2002
Filed: Feb 3, 2000
Inventors
Thomas P. Glenn
Steven M. Anderson
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.