Granted Patent
Utility
US 6,404,052 · App. 09/610,674
Multi-layer flexible printed wiring board
Inventors:
Hideyuki Kurita, Masayuki Nakamura
Patented Case
View Patent ↗
Granted: Jun 11, 2002
Filed: Jul 7, 2000
Inventors
Hideyuki Kurita
Masayuki Nakamura
Assignee (at issue)
Sony Chemicals Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.