Granted Patent
Utility
US 6,406,636 · App. 09/324,342
Methods for wafer to wafer bonding using microstructures
Inventor:
Vladimir Vaganov
Patented Case
View Patent ↗
Granted: Jun 18, 2002
Filed: Jun 2, 1999
Inventor
Vladimir Vaganov
Assignee (at issue)
MegaSense, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.