Granted Patent
Utility
US 6,406,937 · App. 09/658,713
Method for producing an electrical connection between the front and rear sides of semiconductor chips
Inventor:
Harry Hedler
Patented Case
View Patent ↗
Granted: Jun 18, 2002
Filed: Sep 11, 2000
Inventor
Harry Hedler
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.