Granted Patent
Utility
US 6,407,360 · App. 09/231,091
Laser cutting apparatus and method
Inventors:
Dae-Ho Choo, Byeong-ill Kim, Sung Uk Jung, Woo-Shik Lee, Bum-Soo Kim
Patented Case
View Patent ↗
Granted: Jun 18, 2002
Filed: Jan 14, 1999
Inventors
Dae-Ho Choo
Byeong-ill Kim
Sung Uk Jung
Woo-Shik Lee
Bum-Soo Kim
Assignee (at issue)
SAMSUNG DISPLAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.