Granted Patent
Utility
US 6,407,448 · App. 09/922,103
Stackable ball grid array semiconductor package and fabrication method thereof
Inventor:
Dong Seok Chun
Patented Case
View Patent ↗
Granted: Jun 18, 2002
Filed: Aug 6, 2001
Inventor
Dong Seok Chun
Assignee (at issue)
Hyundai Electronics Industries Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.