Granted Patent
Utility
US 6,407,458 · App. 09/565,586
Moisture-resistant integrated circuit chip package and method
Inventor:
Ronald Patrick Huemoeller
Patented Case
View Patent ↗
Granted: Jun 18, 2002
Filed: May 4, 2000
Inventor
Ronald Patrick Huemoeller
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.