IP Library Granted Patent US 6,409,543
Granted Patent Utility
US 6,409,543 · App. 09/769,868

Connector molding method and shielded waferized connector made therefrom

Inventors: Allan Astbury, Thomas S. Cohen
Patented Case View Patent ↗
Granted: Jun 25, 2002 Filed: Jan 25, 2001
Inventors
Allan Astbury
Thomas S. Cohen
Assignee (at issue)
Teradyne, Inc.

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Quick Facts
Patent No.
US 6,409,543
App. No.
09/769,868
Filed
2001-01-25
Granted
2002-06-25
Kind
B1