Granted Patent
Utility
US 6,409,781 · App. 09/562,298
Polishing slurries for copper and associated materials
Inventors:
William A. Wojtczak, Thomas H. Baum, Long Nguyen, Cary Regulski
Patented Case
View Patent ↗
Granted: Jun 25, 2002
Filed: May 1, 2000
Inventors
William A. Wojtczak
Thomas H. Baum
Long Nguyen
Cary Regulski
Assignee (at issue)
ADVANCED TECHNOLOGY & MATERIALS CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.