Granted Patent
Utility
US 6,410,981 · App. 09/176,326
Vented semiconductor device package having separate substrate, strengthening ring and cap structures
Inventor:
Tetsuya Tao
Patented Case
View Patent ↗
Granted: Jun 25, 2002
Filed: Oct 22, 1998
Inventor
Tetsuya Tao
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.