Granted Patent
Utility
US 6,413,102 · App. 09/469,630
Center bond flip chip semiconductor carrier and a method of making and using it
Inventors:
Tongbi Jiang, Alan G. Wood
Patented Case
View Patent ↗
Granted: Jul 2, 2002
Filed: Dec 22, 1999
Inventors
Tongbi Jiang
Alan G. Wood
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.