IP Library Granted Patent US 6,414,365
Granted Patent Utility
US 6,414,365 · App. 09/968,121

Thin-layer silicon-on-insulator (SOI) high-voltage device structure

Inventors: Ted Letavic, Mark Simpson
Patented Case View Patent ↗
Granted: Jul 2, 2002 Filed: Oct 1, 2001
Inventors
Ted Letavic
Mark Simpson
Assignee (at issue)
KONINKLIJKE PHILIPS ELECTRONICS NV

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Quick Facts
Patent No.
US 6,414,365
App. No.
09/968,121
Filed
2001-10-01
Granted
2002-07-02
Kind
B1