IP Library Granted Patent US 6,416,618
Granted Patent Utility
US 6,416,618 · App. 09/354,574

Wafer processing apparatus

Inventors: Masaaki Tsuchihashi, Minoru Hanazaki, Hideki Oura
Patented Case View Patent ↗
Granted: Jul 9, 2002 Filed: Jul 16, 1999
Inventors
Masaaki Tsuchihashi
Minoru Hanazaki
Hideki Oura
Assignees (at issue)
MITSUBISHI ELECTRIC CORPORATION
Mitsubishi Denki Engineering Kabushiki Kaisha

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Quick Facts
Patent No.
US 6,416,618
App. No.
09/354,574
Filed
1999-07-16
Granted
2002-07-09
Kind
B2