IP Library Granted Patent US 6,417,065
Granted Patent Utility
US 6,417,065 · App. 09/718,190

Method of fabricating a bottom electrode

Inventors: King-Lung Wu, Kun-Chi Lin
Patented Case View Patent ↗
Granted: Jul 9, 2002 Filed: Nov 20, 2000
Inventors
King-Lung Wu
Kun-Chi Lin
Assignee (at issue)
WINBOND ELECTRONICS CORP.

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Quick Facts
Patent No.
US 6,417,065
App. No.
09/718,190
Filed
2000-11-20
Granted
2002-07-09
Kind
B1