Granted Patent
Utility
US 6,417,573 · App. 09/531,547
High temperature flip chip joining flux that obviates the cleaning process
Inventor:
Rajendra D. Pendse
Patented Case
View Patent ↗
Granted: Jul 9, 2002
Filed: Mar 20, 2000
Inventor
Rajendra D. Pendse
Assignee (at issue)
Agilent Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.