Granted Patent
Utility
US 6,418,875 · App. 09/902,062
Method of improving adhesion of cap oxide to nanoporous silica for integrated circuit fabrication
Inventor:
Rao Annapragada
Patented Case
View Patent ↗
Granted: Jul 16, 2002
Filed: Jul 9, 2001
Inventor
Rao Annapragada
Assignee (at issue)
KONINKLIJKE PHILIPS ELECTRONICS NV
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.