Granted Patent
Utility
US 6,420,255 · App. 09/484,857
Mounting substrate with a solder resist layer and method of forming the same
Inventor:
Hisaya Takahashi
Patented Case
View Patent ↗
Granted: Jul 16, 2002
Filed: Jan 18, 2000
Inventor
Hisaya Takahashi
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.