Granted Patent
Utility
US 6,423,629 · App. 09/583,514
Multilevel copper interconnects with low-k dielectrics and air gaps
Inventors:
Kie Y. Ahn, Leonard Forbes
Patented Case
View Patent ↗
Granted: Jul 23, 2002
Filed: May 31, 2000
Inventors
Kie Y. Ahn
Leonard Forbes
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.