Granted Patent
Utility
US 6,424,023 · App. 09/513,232
Leadframe for molded semiconductor package and semiconductor package made using the leadframe
Inventors:
Gi Jeong Kim, Seung-Mo Kim, Jin A Lee
Patented Case
View Patent ↗
Granted: Jul 23, 2002
Filed: Feb 24, 2000
Inventors
Gi Jeong Kim
Seung-Mo Kim
Jin A Lee
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.