IP Library › Granted Patent US 6,426,295
Granted Patent Utility
US 6,426,295 · App. 09/584,468

Reduction of surface roughness during chemical mechanical planarization(CMP)

Inventors: Stephen J. Kramer, Scott Meikle
Patented Case View Patent ↗
Granted: Jul 30, 2002 Filed: May 31, 2000
Inventors
Stephen J. Kramer
Scott Meikle
Assignee (at issue)
Micron Technology, Inc.

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Quick Facts
Patent No.
US 6,426,295
App. No.
09/584,468
Filed
2000-05-31
Granted
2002-07-30
Kind
B1