Granted Patent
Utility
US 6,428,398 · App. 09/737,738
Method for wafer polishing and method for polishing-pad dressing
Inventors:
Shin Hashimoto, Yoshiharu Hidaka
Patented Case
View Patent ↗
Granted: Aug 6, 2002
Filed: Dec 18, 2000
Inventors
Shin Hashimoto
Yoshiharu Hidaka
Assignee (at issue)
SUMITOMO ELECTRIC INDUSTRIES, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.