Granted Patent
Utility
US 6,428,641 · App. 09/385,695
Method for laminating circuit pattern tape on semiconductor wafer
Inventors:
Ju Hoon Yoon, Woo-Hyun Kong, Chang-Bok Lee, Sung Jin Yang
Patented Case
View Patent ↗
Granted: Aug 6, 2002
Filed: Aug 30, 1999
Inventors
Ju Hoon Yoon
Woo-Hyun Kong
Chang-Bok Lee
Sung Jin Yang
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.