Granted Patent
Utility
US 6,429,048 · App. 09/730,440
Metal foil laminated IC package
Inventors:
Neil McLellan, Chun Ho Fan, Kwok Cheung Tsang, Pik Ling Lau
Patented Case
View Patent ↗
Granted: Aug 6, 2002
Filed: Dec 5, 2000
Inventors
Neil McLellan
Chun Ho Fan
Kwok Cheung Tsang
Pik Ling Lau
Assignee (at issue)
A-SAT CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.