Granted Patent
Utility
US 6,429,503 · App. 09/888,034
Connection element in an integrated circuit having a layer structure disposed between two conductive structures
Inventors:
Matthias Lehr, Rene Tews, Jochen Müller, Jürgen Lindolf
Patented Case
View Patent ↗
Granted: Aug 6, 2002
Filed: Jun 22, 2001
Inventors
Matthias Lehr
Rene Tews
Jochen Müller
Jürgen Lindolf
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.