IP Library Granted Patent US 6,429,520
Granted Patent Utility
US 6,429,520 · App. 09/391,039

Semiconductor component with silicon wiring and method of fabricating the component

Inventors: Ronald Kakoschke, Regina Stokan
Patented Case View Patent ↗
Granted: Aug 6, 2002 Filed: Sep 7, 1999
Inventors
Ronald Kakoschke
Regina Stokan
Assignee (at issue)
Siemens Aktiengesellschaft

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Quick Facts
Patent No.
US 6,429,520
App. No.
09/391,039
Filed
1999-09-07
Granted
2002-08-06
Kind
B1