Granted Patent
Utility
US 6,429,530 · App. 09/184,839
Miniaturized chip scale ball grid array semiconductor package
Inventor:
William T. Chen
Patented Case
View Patent ↗
Granted: Aug 6, 2002
Filed: Nov 2, 1998
Inventor
William T. Chen
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.