Granted Patent
Utility
US 6,432,737 · App. 09/754,239
Method for forming a flip chip pressure sensor die package
Inventor:
Steven Webster
Patented Case
View Patent ↗
Granted: Aug 13, 2002
Filed: Jan 3, 2001
Inventor
Steven Webster
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.