Granted Patent
Utility
US 6,432,750 · App. 09/789,557
Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof
Inventors:
Gi-young Jeon, Eul-bin Im, Byeong Gon KIM, Eun Ho Lee
Patented Case
View Patent ↗
Granted: Aug 13, 2002
Filed: Feb 22, 2001
Inventors
Gi-young Jeon
Eul-bin Im
Byeong Gon KIM
Eun Ho Lee
Assignee (at issue)
Fairchild Korea Semiconductor Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.