IP Library Granted Patent US 6,432,821
Granted Patent Utility
US 6,432,821 · App. 09/739,930

Method of copper electroplating

Inventors: Valery M. Dubin, Dave W. Jentz, Christopher Collazo-Davila
Patented Case View Patent ↗
Granted: Aug 13, 2002 Filed: Dec 18, 2000
Inventors
Valery M. Dubin
Dave W. Jentz
Christopher Collazo-Davila
Assignee (at issue)
Intel Corporation

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Quick Facts
Patent No.
US 6,432,821
App. No.
09/739,930
Filed
2000-12-18
Granted
2002-08-13
Kind
B1