Granted Patent
Utility
US 6,432,828 · App. 09/040,630
Chemical mechanical polishing slurry useful for copper substrates
Inventors:
Vlasta Brusic Kaufman, Rodney Kistler, Shumin Wang
Patented Case
View Patent ↗
Granted: Aug 13, 2002
Filed: Mar 18, 1998
Inventors
Vlasta Brusic Kaufman
Rodney Kistler
Shumin Wang
Assignee (at issue)
Cabot Microelectronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.