Granted Patent
Utility
US 6,433,277 · App. 09/615,107
Plastic integrated circuit package and method and leadframe for making the package
Inventor:
Thomas P. Glenn
Patented Case
View Patent ↗
Granted: Aug 13, 2002
Filed: Jul 13, 2000
Inventor
Thomas P. Glenn
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.