Granted Patent
Utility
US 6,433,425 · App. 09/660,558
Electronic package interconnect structure comprising lead-free solders
Inventor:
Amit K. Sarkhel
Patented Case
View Patent ↗
Granted: Aug 13, 2002
Filed: Sep 12, 2000
Inventor
Amit K. Sarkhel
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.