Granted Patent
Utility
US 6,435,653 · App. 09/972,648
Multilayered ceramic substrate serving as ink manifold and electrical interconnection platform for multiple printhead dies
Inventors:
Melissa D. Boyd, Timothy Beerling, Timothy L. Weber
Patented Case
View Patent ↗
Granted: Aug 20, 2002
Filed: Oct 5, 2001
Inventors
Melissa D. Boyd
Timothy Beerling
Timothy L. Weber
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.