Granted Patent
Utility
US 6,435,957 · App. 09/750,839
Wafer polishing pad centering apparatus
Inventor:
Terrence Stemm
Patented Case
View Patent ↗
Granted: Aug 20, 2002
Filed: Dec 28, 2000
Inventor
Terrence Stemm
Assignee (at issue)
Intel Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.