Granted Patent
Utility
US 6,436,736 · App. 09/710,623
Method for manufacturing a semiconductor package on a leadframe
Inventors:
Saat Shukri Embong, Hou Boon Tan, Kuan Ming Kan
Patented Case
View Patent ↗
Granted: Aug 20, 2002
Filed: Nov 13, 2000
Inventors
Saat Shukri Embong
Hou Boon Tan
Kuan Ming Kan
Assignee (at issue)
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.