Granted Patent
Utility
US 6,437,427 · App. 09/391,792
Lead frame used for the fabrication of semiconductor packages and semiconductor package fabricated using the same
Inventor:
Yeon Ho Choi
Patented Case
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Granted: Aug 20, 2002
Filed: Sep 8, 1999
Inventor
Yeon Ho Choi
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.