Granted Patent
Utility
US 6,439,897 · App. 09/999,134
Socket apparatus for removably mounting electronic packages with improved contacting system
Inventor:
Kiyokazu Ikeya
Patented Case
View Patent ↗
Granted: Aug 27, 2002
Filed: Nov 1, 2001
Inventor
Kiyokazu Ikeya
Assignee (at issue)
Texas Instruments Incorporated
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.