Granted Patent
Utility
US 6,440,846 · App. 09/584,729
Method for forming semiconductor device
Inventor:
Masahisa Ikeya
Patented Case
View Patent ↗
Granted: Aug 27, 2002
Filed: Jun 1, 2000
Inventor
Masahisa Ikeya
Assignee (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.