Granted Patent
Utility
US 6,441,319 · App. 09/749,470
Inserted components for via connection of signal tracks to achieve continuous impedance matching in multi-layer substrate
Inventors:
Martin R. Handforth, Herman Kwong, Richard R. Goulette, Rolf Meier
Patented Case
View Patent ↗
Granted: Aug 27, 2002
Filed: Dec 28, 2000
Inventors
Martin R. Handforth
Herman Kwong
Richard R. Goulette
Rolf Meier
Assignee (at issue)
Nortel Networks Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.