Granted Patent
Utility
US 6,441,475 · App. 09/733,823
Chip scale surface mount package for semiconductor device and process of fabricating the same
Inventors:
Felix Zandman, Y. Mohammed Kasem, Yueh-Se Ho
Patented Case
View Patent ↗
Granted: Aug 27, 2002
Filed: Dec 8, 2000
Inventors
Felix Zandman
Y. Mohammed Kasem
Yueh-Se Ho
Assignee (at issue)
VISHAY INTERTECHNOLOGY, INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.