IP Library › Granted Patent US 6,441,487
Granted Patent Utility
US 6,441,487 · App. 08/954,426

Chip scale package using large ductile solder balls

Inventors: Peter Elenius, Harry Hollack
Patented Case View Patent ↗
Granted: Aug 27, 2002 Filed: Oct 20, 1997
Inventors
Peter Elenius
Harry Hollack
Assignee (at issue)
Flip Chip Technologies, L.L.C.

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Quick Facts
Patent No.
US 6,441,487
App. No.
08/954,426
Filed
1997-10-20
Granted
2002-08-27
Kind
B2