Granted Patent
Utility
US 6,444,499 · App. 09/539,314
Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components
Inventors:
Gary L. Swiss, Thomas P. Glenn
Patented Case
View Patent ↗
Granted: Sep 3, 2002
Filed: Mar 30, 2000
Inventors
Gary L. Swiss
Thomas P. Glenn
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.