IP Library Granted Patent US 6,444,918
Granted Patent Utility
US 6,444,918 · App. 09/892,995

Interconnection structure of semiconductor element

Inventor: Eiichi Umemura
Patented Case View Patent ↗
Granted: Sep 3, 2002 Filed: Jun 28, 2001
Inventor
Eiichi Umemura
Assignee (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.

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Quick Facts
Patent No.
US 6,444,918
App. No.
09/892,995
Filed
2001-06-28
Granted
2002-09-03
Kind
B1